TEC/350/100 - Equipotential Bonding SPD

TEC/350/100 - Equipotential Bonding Earthing SPD

This device is designed for the equipotential bonding of earthing systems that cannot be directly connected under normal conditions. During normal operation the device is effectively open circuit, maintaining isolation between the two earth systems.

During fault conditions that generate a large enough potential between the two earth systems, the device switches to a short circuit condition, connecting the two for the duration of the fault before automatically re-setting to an open circuit state.